Red sensitive photomaterials for photomasks
 PFG - Silver-Halide photomaterial
 


Figure 1 : Characteristic curve (PFG).

 
Figure 2: Grain Size Distribution Curve (PFG)

 

 
The PFG Silver Halide materials are equivalent to the well-known technical photo-materials previously produced by Agfa and Kodak. All materials can optionally be supplied coated onto Polyester or Triacetate substrate films. The characteristic curve for the PFG is shown in Figs. 1. The grain size distribution is shown in Fig. 2.
 
PFG photographic plates are a practical replacement for Agfa (Millimask) and Kodak (HR-P, TE) plates.
 
The plates are specifically designed for the manufacturing of high-precision photographic masks for microelectronics. High resolution, high durability and excellent adhesion of the emulsion layer to the glass substrate enable photographic features of less than 2.5 micrometers to be recorded. All photo-plates are usually supplied in a cardboard package containing 6 units each. The largest plate size available as a standard size is 406x300 mm. The standard glass thickness is 2.5 mm. Antireflection plates coating on request. Guaranteed lifetime - 12 months.
 PFG materials characteristics

 

Average sensitivity, ISO
Negative process:
Reversal Process:

0.02
0.04
Contrast, not less than: 5
Max. Density, not less than: 3
Spectral sensitization maximum, nm: 640
Spectral sensitization region, nm: 600-680
Fog Density, not more than: 0.02
Resolving Power, mm-1, not less than: 3,000
Strength of emulsion layer after processing, kg force, not less than:  0.9
Temperature of emulsion layer deformation, oC, not less than: 55


 Processing and Handling Recommendations:

 

-  Unseal and process in indirect non-actinic light with use of a dark-red light filter (transmission zone 600 nm and more).
- Temperature of processing solutions - 20±2°C.
- Storage condition: Humidity 65% and 12-15deg. Celsius.

A characteristic curve for the VRP series materials is shown in Figs. 1. The grain size distribution for VRP material is shown in Fig. 2

 

 

Recommended processing for PFG materials for the masks production
 
Negative process Temperature of solutions
Exposure    
Developing Concentrated VRP developer diluted in distilled water 1:5, 4-5min
20
Wash Rinsing water 3 min
17±2
Fixing Fixer , 5-10 min
20
Wash Water 3 min
17±2
Final Wash Water with wetting agent (Agepon) 1min
17±2
Drying Slow Air
20±4
Reversal process  
Exposure    
Developing Concentrated VRP developer diluted in distilled water 1:1.7, 4-5min
20
Wash Rinsing water, 3 min
17±2
Bleaching Bleach , 1.5 min
20
Wash Rinsing water, 3 min
17±2
Brightening Brightener , 3 min
20
Wash Rinsing water, 5 min
17±2
Lighting 500 W lamp, 70cm distance from the emulsion, 1 min  
Second Developing Concentrated VRP developer diluted in distilled water 1:5 - 3 minutes
20
Wash Rinsing water, 1 min
17±2
Fixing Fixer , 2 min
20±4
Wash Rinsing water, 3 min
17±2
Final wash Water with wetting agent (Agepon) 1min
17±2
Drying Slow Air
20±4
 

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